Work function adjustment in high-k metal gate electrode structures by selectively removing a barrier layer
US8298894B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2010 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Feb 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/691
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a replacement gate approach in sophisticated semiconductor devices, a tantalum nitride etch stop material may be efficiently removed on the basis of a wet chemical etch recipe using ammonium hydroxide. Consequently, a further work function adjusting material may be formed with superior uniformity, while the efficiency of the subsequent adjusting of the work function may also be increased. Thus, superior uniformity, i.e., less pronounced transistor variability, may be accomplished on the basis of a replacement gate approach in which the work function of the gate electrodes of P-channel transistors and N-channel transistors is adjusted after completing the basic transistor configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.