Apparatus and method of aligning and positioning a cold substrate on a hot surface
US8309475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2012 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jan 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.