Inventor · Yongin-si, KR

JiHoon Oh

22Patents
7h-index
24Co-inventors
65Inventor score

Filing activity: May 30, 2008 → Mar 12, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US8004093B2 Integrated circuit package stacking system Electricity 35 Active
US7683469B2 Package-on-package system with heat spreader Electricity 24 Active
US8343810B2 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers Electricity 15 Active
US8003496B2 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Electricity 14 Active
US8836114B2 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers Electricity 13 Active
US8531012B2 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Electricity 9 Active
US10050227B2 Display apparatus Emerging Cross-Sectional Technologies 8 Active
US8432028B2 Integrated circuit packaging system with package-on-package and method of manufacture thereof Electricity 6 Active
US9401347B2 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Electricity 5 Active
US9379064B2 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Electricity 4 Active
US10217807B2 Anisotropic conductive film and display device using the same Emerging Cross-Sectional Technologies 3 Active
US10672853B2 Flexible display apparatus Emerging Cross-Sectional Technologies 3 Active
US9048209B2 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Electricity 2 Active
US8310038B2 Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof Electricity 2 Active
US9196213B2 Gate driving circuit and display device having the same Physics 1 Active
US8937371B2 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Electricity 1 Active
US8569870B1 Integrated circuit packaging system with shielding spacer and method of manufacture thereof Electricity 1 Active
US10088703B2 Method of manufacturing display device Physics 0 Active
US8709932B2 Integrated circuit packaging system with interconnects and method of manufacture thereof Electricity 0 Active
US11226696B2 Display device Physics 0 Active
US9933655B2 Polarizer and display device comprising the same Physics 0 Active
US11683963B2 Anisotropic conductive film and display device using the same Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.