Method and apparatus for removing polymer from the wafer backside and edge

US8329593B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Imad Yousif · San Jose, US
• Anchel Sheyner · San Francisco, US
• Ajit Balakrishna · Sunnyvale, US
• Nancy Fung · Sunnyvale, US
• Ying Rui · Meridian, US
• Martin Jeffrey Salinas · Campbell, US
• Walter R. Merry · Cupertino, US
• Shahid Rauf · Pleasanton, US

Key dates

• Filing date: Dec 12, 2007
• Grant date: Dec 11, 2012
• Expiry date: Feb 6, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/0209
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Polymer is removed from the backside of a wafer held on a support pedestal in a reactor using an arcuate side gas injection nozzle extending through the reactor side wall with a curvature matched to the wafer edge and supplied with plasma by-products from a remote plasma source.