Inventor · Pleasanton, CA, US

Shahid Rauf

90Patents
12h-index
109Co-inventors
87Inventor score

Filing activity: Oct 6, 1989 → Feb 13, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9741546B2 Symmetric plasma process chamber Electricity 365 Active
US8512509B2 Plasma reactor gas distribution plate with radially distributed path splitting manifold Electricity 211 Active
US8404598B2 Synchronized radio frequency pulsing for plasma etching Electricity 69 Active
US8382999B2 Pulsed plasma high aspect ratio dielectric process Electricity 51 Active
US7968469B2 Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity Electricity 39 Active
US8313664B2 Efficient and accurate method for real-time prediction of the self-bias voltage of a wafer and feedback control of ESC voltage in plasma processing chamber Electricity 35 Active
US10546728B2 Symmetric plasma process chamber Electricity 35 Active
US10453656B2 Symmetric plasma process chamber Electricity 33 Active
US10580620B2 Symmetric plasma process chamber Electricity 33 Active
US10535502B2 Symmetric plasma process chamber Electricity 32 Active
US8962488B2 Synchronized radio frequency pulsing for plasma etching Electricity 23 Active
US8075728B2 Gas flow equalizer plate suitable for use in a substrate process chamber Electricity 20 Active
US7544605B2 Method of making a contact on a backside of a die Electricity 12 Active
US7967996B2 Process for wafer backside polymer removal and wafer front side photoresist removal Electricity 10 Active
US7579282B2 Method for removing metal foot during high-k dielectric/metal gate etching Electricity 9 Active
US8206552B2 RF power delivery system in a semiconductor apparatus Electricity 8 Active
US7988815B2 Plasma reactor with reduced electrical skew using electrical bypass elements Electricity 8 Active
US7335602B2 Charge-free layer by layer etching of dielectrics Electricity 7 Expired
US7879731B2 Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources Electricity 7 Active
US8329593B2 Method and apparatus for removing polymer from the wafer backside and edge Electricity 7 Active
US9161428B2 Independent control of RF phases of separate coils of an inductively coupled plasma reactor Electricity 7 Active
US8076247B2 Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes Electricity 7 Active
US7552736B2 Process for wafer backside polymer removal with a ring of plasma under the wafer Electricity 6 Active
US9082590B2 Symmetrical inductively coupled plasma source with side RF feeds and RF distribution plates Electricity 6 Active
US10170279B2 Multiple coil inductively coupled plasma source with offset frequencies and double-walled shielding Electricity 6 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.