Surface processing method for mounting stage
US8343372B2 · kind B2 · utility
0Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Dec 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.