Patent · US Active

Molding windows in thin pads

US8393940B2 · kind B2 · utility

8Cited by

7References

13Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Boguslaw A. Swedek · Cupertino, US
Doyle E. Bennett · Santa Clara, US
Dominic J. Benvegnu · La Honda, US

Key dates

Filing date	Apr 16, 2010
Grant date	Mar 12, 2013
Priority date	—
Expiry date	May 24, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/205
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.