Coils for generating a plasma and for sputtering
US8398832B2 · kind B2 · utility
5Cited by
83References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2005 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Jan 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.