Pre-planarization system and method
US8403727B1 · kind B1 · utility
2Cited by
8References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Feb 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for producing a normalized surface on a substrate for a chemical mechanical planarization process is provided. The method initiates with grinding a surface of the substrate with a first surface associated with a first planarization length. The method includes planarizing the surface of the substrate with a second surface associated with a second planarization length. Here, the second planarization length being less than the first planarization length. A system for processing a semiconductor substrate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.