Semiconductor component including a semiconductor chip and a passive component

US8471393B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thorsten Meyer · Regensburg, DE
• Bernd Waidhas · Nittendorf, DE
• Markus Brunnbauer · Lappersdorf, DE
• Grit Sommer · Grafing, DE
• Thomas Wagner · Regelsbach, DE

Key dates

• Filing date: Dec 21, 2006
• Grant date: Jun 25, 2013
• Expiry date: Oct 29, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor component includes a semiconductor chip, and a passive component, with the semiconductor component including a coil as the passive component. The semiconductor chip and the passive component are embedded in a plastic encapsulation compound with connection elements to external contacts.