Methods and apparatus for controlling substrate temperature in a process chamber
US8633423B2 · kind B2 · utility
121Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2011 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Apr 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for controlling the temperature of a substrate during processing are provided herein. In some embodiments, an apparatus for retaining and controlling substrate temperature may include a puck of dielectric material; an electrode disposed in the puck proximate a surface of the puck upon which a substrate is to be retained; and a plurality of heater elements disposed in the puck and arranged in concentric rings to provide independent temperature control zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.