Antioxidants for post-CMP cleaning formulations
US8685909B2 · kind B2 · utility
19Cited by
51References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2009 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Dec 28, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D7/3281
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.