Method for exposing an area on a substrate to a beam and photolithographic system
US8715910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2008 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Oct 26, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70725
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the invention describe a method for exposing an area on a substrate to a beam. The method includes adjusting a focus offset of the beam with respect to the area on the substrate, tilting the beam or tilting the substrate, and exposing the area on the substrate with the beam, thereby generating locations within the area exposed with different foci. Furthermore embodiments describe computer programs for controlling a photolithographic system to do the same and a photolithographic system for doing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.