Patent · US Active

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

US8741690B2 · kind B2 · utility

16Cited by

0References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Rainer Leuschner · Regensburg, DE
Gerald Ofner · Regensburg, DE
Reinhard Hess · Straubing, DE
Recai Sezi · Simmerath, DE

Key dates

Filing date	Apr 23, 2012
Grant date	Jun 3, 2014
Priority date	—
Expiry date	Nov 21, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a semiconductor package includes embedding a semiconductor chip in an encapsulant. First contact pads are formed on a first main face of the semiconductor package and second contact pads are formed on a second main face of the semiconductor package opposite the first main face. A diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, where x is a pitch of the second contact pads in micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.