Layout designs with via routing structures
US8741763B2 · kind B2 · utility
32Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2012 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Aug 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An approach for providing layout designs with via routing structures is disclosed. Embodiments include: providing a gate structure and a diffusion contact on a substrate; providing a gate contact on the gate structure; providing a metal routing structure that does not overlie a portion of the gate contact, the diffusion contact, or a combination thereof; and providing a via routing structure over the portion and under a part of the metal routing structure to couple the gate contact, the diffusion contact, or a combination thereof to the metal routing structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.