Patent · US Active

Processing system with the dual end-effector handling

US8796589B2 · kind B2 · utility

7Cited by

35References

28Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Efrain Quiles · San Lorenzo, US
Mehran Behdjat · San Jose, US
Robert B. Lowrance · Los Gatos, US
Michael R. Rice · Pleasanton, US
Brent Vopat · Austin, US

Key dates

Filing date	Jul 13, 2002
Grant date	Aug 5, 2014
Priority date	—
Expiry date	Nov 14, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T137/0318
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.