Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity
US8822876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Feb 8, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.