Methods of forming a semiconductor device with a protected gate cap layer and the resulting device
US8871582B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One method includes forming a recessed gate/spacer structure that partially defines a spacer/gate cap recess, forming a gate cap layer in the spacer/gate cap recess, forming a gate cap protection layer on an upper surface of the gate cap layer, and removing portions of the gate cap protection layer, leaving a portion of the gate cap protection layer positioned on the upper surface of the gate cap layer. A device disclosed herein includes a gate/spacer structure positioned in a layer of insulating material, a gate cap layer positioned on the gate/spacer structure, wherein sidewalls of the gate cap layer contact the layer of insulating material, and a gate cap protection layer positioned on an upper surface of the gate cap layer, wherein the sidewalls of the gate cap protection layer also contact the layer of insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.