Daniel T. Pham
28Patents
10h-index
61Co-inventors
74Inventor score
Filing activity: Feb 22, 1999 → Mar 9, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6838322B2 | Method for forming a double-gated semiconductor device | Electricity | 176 | Expired |
| US8846491B1 | Forming a diffusion break during a RMG process | Electricity | 84 | Active |
| US9064932B1 | Methods of forming gate structures by a gate-cut-last process and the resulting structures | Electricity | 81 | Active |
| US6413819B1 | Memory device and method for using prefabricated isolated storage elements | Electricity | 61 | Expired |
| US9064801B1 | Bi-layer gate cap for self-aligned contact formation | Electricity | 31 | Active |
| US8728885B1 | Methods of forming a three-dimensional semiconductor device with a nanowire channel structure | Electricity | 20 | Active |
| US6261978A | Process for forming semiconductor device with thick and thin films | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6509609B1 | Grooved channel schottky MOSFET | Electricity | 14 | Expired |
| US7943988B2 | Power MOSFET with a gate structure of different material | Electricity | 11 | Active |
| US8669147B2 | Methods of forming high mobility fin channels on three dimensional semiconductor devices | Electricity | 10 | Active |
| US8309410B2 | Power MOSFET with a gate structure of different material | Electricity | 9 | Active |
| US8906754B2 | Methods of forming a semiconductor device with a protected gate cap layer and the resulting device | Electricity | 7 | Active |
| US6753216B2 | Multiple gate transistor employing monocrystalline silicon walls | Electricity | 6 | Expired |
| US9219002B2 | Overlay performance for a fin field effect transistor device | Electricity | 6 | Active |
| US9419137B1 | Stress memorization film and oxide isolation in fins | Electricity | 6 | Active |
| US9184263B2 | Methods of forming gate structures for semiconductor devices using a replacement gate technique and the resulting devices | Electricity | 5 | Active |
| US8853019B1 | Methods of forming a semiconductor device with a nanowire channel structure by performing an anneal process | Performing Operations; Transporting | 5 | Active |
| US8871582B2 | Methods of forming a semiconductor device with a protected gate cap layer and the resulting device | Electricity | 4 | Active |
| US9263585B2 | Methods of forming enhanced mobility channel regions on 3D semiconductor devices, and devices comprising same | Electricity | 4 | Active |
| US7645651B2 | LDMOS with channel stress | Electricity | 4 | Active |
| US8877588B2 | Methods of forming a three-dimensional semiconductor device with a dual stress channel and the resulting device | Electricity | 4 | Active |
| US6949455B2 | Method for forming a semiconductor device structure a semiconductor layer | Electricity | 3 | Expired |
| US9263537B2 | Methods of forming a semiconductor device with a protected gate cap layer and the resulting device | Electricity | 2 | Active |
| US8618616B2 | FinFET structures and methods for fabricating the same | Electricity | 2 | Active |
| US6689676B1 | Method for forming a semiconductor device structure in a semiconductor layer | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.