Balasubramanian Pranatharthiharan
213Patents
13h-index
113Co-inventors
85Inventor score
Filing activity: May 1, 2006 → Apr 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9660028B1 | Stacked transistors with different channel widths | Electricity | 69 | Active |
| US9064801B1 | Bi-layer gate cap for self-aligned contact formation | Electricity | 31 | Active |
| US9337094B1 | Method of forming contact useful in replacement metal gate processing and related semiconductor structure | Electricity | 28 | Active |
| US10505111B1 | Confined phase change memory with double air gap | Emerging Cross-Sectional Technologies | 24 | Active |
| US8753970B2 | Methods of forming semiconductor devices with self-aligned contacts and the resulting devices | Electricity | 21 | Active |
| US8586455B1 | Preventing shorting of adjacent devices | Electricity | 21 | Active |
| US9431399B1 | Method for forming merged contact for semiconductor device | Electricity | 18 | Active |
| US9721848B1 | Cutting fins and gates in CMOS devices | Electricity | 17 | Active |
| US9741823B1 | Fin cut during replacement gate formation | Electricity | 16 | Active |
| US9034741B2 | Halo region formation by epitaxial growth | Electricity | 15 | Active |
| US9570555B1 | Source and drain epitaxial semiconductor material integration for high voltage semiconductor devices | Electricity | 15 | Active |
| US9443853B1 | Minimizing shorting between FinFET epitaxial regions | Electricity | 14 | Active |
| US9397006B1 | Co-integration of different fin pitches for logic and analog devices | Electricity | 14 | Active |
| US9923078B2 | Trench silicide contacts with high selectivity process | Electricity | 13 | Active |
| US9472447B1 | Confined eptaxial growth for continued pitch scaling | Electricity | 13 | Active |
| US9685340B2 | Stable contact on one-sided gate tie-down structure | Electricity | 12 | Active |
| US8937359B2 | Contact formation for ultra-scaled devices | Electricity | 11 | Active |
| US9147576B2 | Gate contact with vertical isolation from source-drain | Electricity | 11 | Active |
| US9305923B1 | Low resistance replacement metal gate structure | Electricity | 10 | Active |
| US9691765B1 | Fin type field effect transistors with different pitches and substantially uniform fin reveal | Electricity | 10 | Active |
| US9935168B2 | Gate contact with vertical isolation from source-drain | Electricity | 8 | Active |
| US9704753B2 | Minimizing shorting between FinFET epitaxial regions | Electricity | 8 | Active |
| US9293551B2 | Integrated multiple gate length semiconductor device including self-aligned contacts | Electricity | 8 | Active |
| US9997418B2 | Dual liner silicide | Electricity | 8 | Active |
| US9461168B1 | Channel strain and controlling lateral epitaxial growth of the source and drain in FinFET devices | Electricity | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.