Circuit structures and methods of fabrication with enhanced contact via electrical connection
US8907496B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2013 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Jun 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Circuit structures and methods of fabrication are provided with enhanced electrical connection between, for instance, a first metal level and a contact surface of a conductive structure. Enhanced electrical connection is achieved using a plurality of contact vias which are differently-sized, and disposed over and electrically coupled to the contact surface. The differently-sized contact vias include at least one center region contact via disposed over a center region of the contact surface, and at least one peripheral region contact via disposed over a peripheral region of the contact surface, where the at least one center region contact via is larger than the at least one peripheral region contact via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.