Guoxiang Ning
42Patents
2h-index
60Co-inventors
56Inventor score
Filing activity: Feb 11, 2009 → Jan 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10199271B1 | Self-aligned metal wire on contact structure and method for forming same | Electricity | 6 | Active |
| US8907496B1 | Circuit structures and methods of fabrication with enhanced contact via electrical connection | Electricity | 4 | Active |
| US10896874B2 | Interconnects separated by a dielectric region formed using removable sacrificial plugs | Electricity | 2 | Active |
| US9500945B1 | Pattern classification based proximity corrections for reticle fabrication | Physics | 2 | Active |
| US10386726B2 | Geometry vectorization for mask process correction | Physics | 2 | Active |
| US10957701B1 | Fin-based anti-fuse device for integrated circuit (IC) products, methods of making such an anti-fuse device and IC products comprising such an anti-fuse device | Electricity | 2 | Active |
| US10892222B1 | Anti-fuse for an integrated circuit (IC) product and method of making such an anti-fuse for an IC product | Electricity | 2 | Active |
| US9236301B2 | Customized alleviation of stresses generated by through-substrate via(S) | Electricity | 1 | Active |
| US9250538B2 | Efficient optical proximity correction repair flow method and apparatus | Physics | 1 | Active |
| US10423078B1 | FinFET cut isolation opening revision to compensate for overlay inaccuracy | Electricity | 1 | Active |
| US10002827B2 | Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device | Emerging Cross-Sectional Technologies | 1 | Active |
| US9606432B2 | Alternating space decomposition in circuit structure fabrication | Physics | 1 | Active |
| US9368453B2 | Overlay mark dependent dummy fill to mitigate gate height variation | Electricity | 1 | Active |
| US10714422B2 | Anti-fuse with self aligned via patterning | Electricity | 1 | Active |
| US9329471B1 | Achieving a critical dimension target based on resist characteristics | Physics | 1 | Active |
| US9645486B2 | Multiple threshold convergent OPC model | Physics | 0 | Active |
| US10332745B2 | Dummy assist features for pattern support | Electricity | 0 | Active |
| US10727120B2 | Controlling back-end-of-line dimensions of semiconductor devices | Electricity | 0 | Active |
| US10804170B2 | Device/health of line (HOL) aware eBeam based overlay (EBO OVL) structure | Electricity | 0 | Active |
| US9672313B2 | Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device | Emerging Cross-Sectional Technologies | 0 | Active |
| US9136223B2 | Forming alignment mark and resulting mark | Electricity | 0 | Active |
| US9384318B2 | Mask error compensation by optical modeling calibration | Physics | 0 | Active |
| US9817940B2 | Method wherein test cells and dummy cells are included into a layout of an integrated circuit | Emerging Cross-Sectional Technologies | 0 | Active |
| US11651992B2 | Gap fill void and connection structures | Electricity | 0 | Active |
| US7923180B2 | Cross technology reticles | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.