Complete power management system implemented in a single surface mount package
US8928138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2010 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | May 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.