Pressure sensing and control for semiconductor wafer probing
US8963567B2 · kind B2 · utility
1Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2011 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Jun 3, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07364
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.