Processing systems and methods for halide scavenging

US9093371B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Anchuan Wang · San Jose, US
• Xinglong Chen · Ürümqi, CN
• Zihui Li · Santa Clara, US
• Hiroshi Hamana · Kasai, JP
• Zhijun Chen · San Jose, US
• Ching-Mei Hsu · Stanford, US
• Jiayin Huang · Fremont, US
• Nitin K. Ingle · San Jose, US
• Dmitry Lubomirsky · Cupertino, US
• Shankar Venkataraman · Santa Clara, US
• Randhir P. S. Thakur · Boise, US

Key dates

• Filing date: Apr 7, 2014
• Grant date: Jul 28, 2015
• Expiry date: Apr 7, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/32137
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional processing capabilities in combination chamber designs. The methods may provide for the limiting, prevention, and correction of aging defects that may be caused as a result of etching processes performed by system tools.