Closed-loop control for improved polishing pad profiles

US9138860B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sivakumar Dhandapani · Santa Clara, US
• Jun Qian · Sunnyvale, US
• Christopher Cocca · Fremont, US
• Jason Garcheung Fung · Sunnyvale, US
• Shou-Sung Chang · Mountain View, US
• Charles C. Garretson · Sunnyvale, US
• Gregory E. Menk · Pleasanton, US
• Stan Tsai · Clifton Park, US

Key dates

• Filing date: Apr 14, 2011
• Grant date: Sep 22, 2015
• Expiry date: Jan 4, 2032

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/042
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.