Processing systems and methods for halide scavenging
US9153442B2 · kind B2 · utility
217Cited by
471References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2014 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Apr 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional processing capabilities in combination chamber designs. The methods may provide for the limiting, prevention, and correction of aging defects that may be caused as a result of etching processes performed by system tools.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.