Patent · US Active

Micro mechanical structure and method for fabricating the same

US9212045B1 · kind B1 · utility

4Cited by

0References

26Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ulrich Schmid · Wien, AT
Tobias Frischmuth · Wien, AT
Peter Irsigler · Ried im Innkreis, AT
Thomas Grille · Villach, AT
Daniel Maurer · Feld am See, AT
Ursula Hedenig · Villach, AT
Markus Kahn · Rangersdorf, AT
Guenter Denifl · Annenheim, AT

Key dates

Filing date	Jul 31, 2014
Grant date	Dec 15, 2015
Priority date	—
Expiry date	Jul 31, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2307/023
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure further includes a conductive base layer having a conductive base layer material. The conductive base layer material includes sectionally in a stiffening section a carbon material such that a carbon concentration of the carbon material in the conductive base layer material is at least 1014 per cubic cm and at least higher by a factor of 103 than in the conductive base layer material adjacent to the stiffening section.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.