Methods of connecting a first electronic package to a second electronic package
US9263329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2014 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Mar 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.