Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

US9275926B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Wolfram Hable · Dresden, DE
• Andreas Grassmann · Villach, AT
• Frank Winter · Mühlheim, DE
• Ottmar Geitner · Pentling, DE
• Alexander Schwarz · Soest, DE
• Alexander Herbrandt · Warstein, DE
• Lothar Koenig · Hemau, DE
• Andre Uhlemann · Dortmund, DE

Key dates

• Filing date: May 3, 2013
• Grant date: Mar 1, 2016
• Expiry date: Sep 5, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.