Automated optical inspection of unit specific patterning
US9401313B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2015 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Nov 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages can comprise providing a plurality of semiconductor die formed as a reconstituted wafer. A plurality of unit specific patterns can be formed by forming a unit specific pattern over each of the plurality of semiconductor die, wherein each of the unit specific patterns is customized to fit its respective semiconductor die. A plurality of images can be acquired by acquiring an image for each of the plurality of unit specific patterns. A plurality of unique reference standards can be created by creating a unique reference standard for each of the plurality of unit specific patterns. Defects can be detected in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to a corresponding one of the plurality of images for each of the plurality of unit specific patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.