Integrated circuit and method of forming an integrated circuit

US9418937B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thomas Detzel · Villach, AT
• Johann Gross · Heilbronn, DE
• Robert Illing · Finkenstein, AT
• Maximilian Krug · Zeitlarn, DE
• Sven Lanzerstorfer · Feldkirchen in Kärnten, AT
• Michael Nelhiebel · Villach, AT
• Werner Robl · Regensburg, DE
• Michael Rogalli · Rottenburg am Neckar, DE
• Stefan Woehlert · Villach, AT

Key dates

• Filing date: Dec 9, 2011
• Grant date: Aug 16, 2016
• Expiry date: Sep 19, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit includes a base element and a copper element over the base element, the copper element having a thickness of at least 5 μm and a ratio of average grain size to thickness of less than 0.7.