Methods for pre-cleaning conductive interconnect structures

US9460959B1 · kind B1 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Xiangjin Xie · Fremont, US
• Feng Q. Liu · San Jose, US
• Daping Yao · San Jose, US
• Alexander Jansen · San Jose, US
• Joung Joo Lee · San Jose, US
• Adolph Miller Allen · Oakland, US
• Xianmin Tang · San Jose, US
• Mei Chang · Saratoga, US

Key dates

• Filing date: Dec 3, 2015
• Grant date: Oct 4, 2016
• Expiry date: Dec 3, 2035

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F05D2230/90
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

Methods for processing a substrate are provided herein. In some embodiments, method of processing a substrate includes: heating a substrate disposed within a processing volume of a substrate processing chamber to a temperature of up to about 400 degrees Celsius, wherein the substrate comprises a first surface, an opposing second surface, and an opening formed in the first surface and extending towards the opposing second surface, and wherein the second surface comprises a conductive material disposed in the second surface and aligned with the opening; and exposing the substrate to a process gas comprising about 80 to about 100 wt % of an alcohol to reduce a contaminated surface of the conductive material.