Mei Chang
43Patents
6h-index
99Co-inventors
68Inventor score
Filing activity: Jan 11, 2011 → Jul 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10121671B2 | Methods of depositing metal films using metal oxyhalide precursors | Electricity | 407 | Active |
| US10400335B2 | Dual-direction chemical delivery system for ALD/CVD chambers | Emerging Cross-Sectional Technologies | 345 | Active |
| US9460959B1 | Methods for pre-cleaning conductive interconnect structures | Mechanical Engineering; Lighting; Heating | 113 | Active |
| US9048183B2 | NMOS metal gate materials, manufacturing methods, and equipment using CVD and ALD processes with metal based precursors | Electricity | 11 | Active |
| US9601339B2 | Methods for depositing fluorine/carbon-free conformal tungsten | Electricity | 9 | Active |
| US9399812B2 | Methods of preventing plasma induced damage during substrate processing | Electricity | 8 | Active |
| US8642468B2 | NMOS metal gate materials, manufacturing methods, and equipment using CVD and ALD processes with metal based precursors | Electricity | 6 | Active |
| US9418890B2 | Method for tuning a deposition rate during an atomic layer deposition process | Chemistry; Metallurgy | 5 | Active |
| US10109534B2 | Multi-threshold voltage (Vt) workfunction metal by selective atomic layer deposition (ALD) | Electricity | 4 | Active |
| US9177780B2 | Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition | Electricity | 3 | Active |
| US10600685B2 | Methods to fill high aspect ratio features on semiconductor substrates with MOCVD cobalt film | Electricity | 2 | Active |
| US9245769B2 | Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition | Electricity | 2 | Active |
| US9595466B2 | Methods for etching via atomic layer deposition (ALD) cycles | Electricity | 2 | Active |
| US10395916B2 | In-situ pre-clean for selectivity improvement for selective deposition | Electricity | 2 | Active |
| US10763090B2 | High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process | Electricity | 1 | Active |
| US10094023B2 | Methods and apparatus for chemical vapor deposition of a cobalt layer | Electricity | 1 | Active |
| US9947578B2 | Methods for forming low-resistance contacts through integrated process flow systems | Electricity | 1 | Active |
| US9824889B2 | CVD silicon monolayer formation method and gate oxide ALD formation on III-V materials | Electricity | 1 | Active |
| US9653318B2 | Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition | Electricity | 1 | Active |
| US9202745B2 | Directional SiO2 etch using low-temperature etchant deposition and plasma post-treatment | Electricity | 1 | Active |
| US10985023B2 | Methods for depositing fluorine/carbon-free conformal tungsten | Electricity | 0 | Active |
| US9147578B2 | Contact clean by remote plasma and repair of silicide surface | Emerging Cross-Sectional Technologies | 0 | Active |
| US11033930B2 | Methods and apparatus for cryogenic gas stream assisted SAM-based selective deposition | Performing Operations; Transporting | 0 | Active |
| US10373824B2 | CVD silicon monolayer formation method and gate oxide ALD formation on semiconductor materials | Electricity | 0 | Active |
| US9857027B2 | Apparatus and method for self-regulating fluid chemical delivery | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.