Antioxidants for post-CMP cleaning formulations
US9528078B2 · kind B2 · utility
2Cited by
59References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | May 12, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.