Patent · US Active

Segmented bond pads and methods of fabrication thereof

US9543260B2 · kind B2 · utility

4Cited by

1References

31Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Albert Birner · Regensburg, DE
Helmut Brech · Lappersdorf, DE
Matthias Zigldrum · Regensburg, DE

Key dates

Filing date	Aug 2, 2013
Grant date	Jan 10, 2017
Priority date	—
Expiry date	Nov 17, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In accordance with an embodiment of the present invention, a semiconductor device includes a first bond pad disposed at a first side of a substrate. The first bond pad includes a first plurality of pad segments. At least one pad segment of the first plurality of pad segments is electrically isolated from the remaining pad segments of the first plurality of pad segments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.