Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release
US9586291B2 · kind B2 · utility
2Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2014 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Mar 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.