Patent · US Active

Injection control in semiconductor power devices

US9620630B2 · kind B2 · utility

4Cited by
4References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 16, 2016
Grant dateApr 11, 2017
Priority date
Expiry dateMar 16, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/513
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Semiconductor power devices can be formed on substrate structure having a lightly doped semiconductor substrate of a first conductivity type or a second conductivity type opposite to the first conductivity type. A semiconductive first buffer layer of the first conductivity type formed above the substrate. A doping concentration of the first buffer layer is greater than a doping concentration of the substrate. A second buffer layer of the second conductivity type formed above the first buffer layer. An epitaxial layer of the second conductivity type formed above the second buffer layer. One or more heavily doped regions of the second conductivity type are formed through portions of the first buffer layer from the second buffer layer and into corresponding portions of the substrate. This abstract is provided with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.