Patent · US Active

Batch process for connecting chips to a carrier

US9673170B2 · kind B2 · utility

2Cited by

8References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Rupert Fischer · Maxhütte-Haidhof, DE
Peter Strobel · Regensburg, DE
Joachim Mahler · Regensburg, DE
Konrad Roesl · Teublitz, DE
Alexander Heinrich · Bad Abbach, DE

Key dates

Filing date	Aug 5, 2014
Grant date	Jun 6, 2017
Priority date	—
Expiry date	Aug 5, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1434
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods for connecting chips to a chip carrier are disclosed. In some embodiments the method for connecting a plurality of chips to a chip carrier includes placing first chips on a transfer carrier, placing second chips on the transfer carrier, placing the transfer carrier with the first and second chips on the chip carrier and forming connections between the first chips and the chip carrier and the second chips and the chip carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.