Hybrid airgap structure with oxide liner
US9780027B2 · kind B2 · utility
8Cited by
27References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2016 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | May 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique relates to an airgap structure. A dielectric layer is formed on an underlying layer. Copper filled trenches are formed in the dielectric layer, and a metal liner lines the copper filled trenches. An oxide liner lines the metal liner and covers the dielectric layer. One or more airgaps are formed between the copper filled trenches in areas in which the oxide liner was not present on the dielectric layer. A cap layer is formed on top of the one or more airgaps, the copper filled trenches, and portions of the oxide liner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.