Patent · US Active

Monitoring system for deposition and method of operation thereof

US9870935B2 · kind B2 · utility

3Cited by

2References

7Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Edward W. Budiarto · Fremont, US
Majeed A. Foad · Sunnyvale, US
Ralf Hofmann · Heidenheim, DE
Thomas Nowak · Cupertino, US
Todd Egan · Fremont, US
Mehdi Vaez-Iravani · Los Gatos, US

Key dates

Filing date	Aug 28, 2015
Grant date	Jan 16, 2018
Priority date	—
Expiry date	Aug 28, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/26
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A monitoring and deposition control system and method of operation thereof including: a deposition chamber for depositing a material layer on a substrate; a sensor array for monitoring deposition of the material layer for changes in a layer thickness of the material layer during deposition; and a processing unit for adjusting deposition parameters based on the changes in the layer thickness during deposition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.