Deposition methods for uniform and conformal hybrid titanium oxide films
US9881787B2 · kind B2 · utility
2Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2016 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jun 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for depositing titanium oxide films by atomic layer deposition are disclosed. Titanium oxide films may include a titanium nitride cap, an oxygen rich titanium nitride cap or a mixed oxide nitride layer. Also described are methods for self-aligned double patterning including titanium oxide spacer films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.