Wire bonded wide I/O semiconductor device
US9899347B1 · kind B1 · utility
6Cited by
5References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2017 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Mar 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wide I/O semiconductor device is disclosed including a memory die stack wire bonded to an interface chip. The stack of memory die may be wire bonded to the interface chip using a wire bond scheme optimized for die-to-die connection and optimized for the large number of wire bond connections in a wide I/O semiconductor device. This method can achieve significant BW increase by improving packaging yield and costs, not possible with current packaging schemes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.