Interconnect structures with fully aligned vias
US9911690B2 · kind B2 · utility
5Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2016 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Feb 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure having fully aligned via connecting metal lines on different Mx levels. The structure may include a first metal line and a second metal line in a first ILD, a cap covering the first ILD, the second metal line and a portion of the first metal line, a second ILD on the cap, and a via that electrically connects the first metal line to a third metal line, wherein the third metal line is above the first metal line and runs perpendicular to the first metal line, the via is fully aligned to the first metal line and the third metal line, and the via electrically connects the first metal line to the third metal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.