Patent · US Active

Distributed, concentric multi-zone plasma source systems, methods and apparatus

US9967965B2 · kind B2 · utility

0Cited by
54References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 26, 2012
Grant dateMay 8, 2018
Priority date
Expiry dateFeb 10, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05H2242/24
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.