Antioxidants for post-CMP cleaning formulations

USRE46427E1 · kind E1 · reissue

Assignee

• ENTEGRIS, INC. · US

Inventors

• David Angst · New Tripoli, US
• Peng Zhang · Montvale, US
• Jeffrey A. Barnes · New Milford, US
• Prerna Sonthalia · Mumbai, IN
• Emanuel I. Cooper · Scarsdale, US
• Karl E. Boggs · Hopewell Junction, US

Key dates

• Filing date: Jan 13, 2015
• Grant date: Jun 6, 2017
• Expiry date: Jan 13, 2035

Classification

• Technology area (CPC —): General

Abstract

An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.