Thermal process chamber lid with backside pumping

US11335591B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Anqing Cui · Palo Alto, US
• Dien-Yeh Wu · San Jose, US
• Wei V. Tang · Santa Clara, US
• Yixiong Yang · San Jose, US
• Bo Wang · Los Gatos, US

Key dates

• Filing date: May 28, 2020
• Grant date: May 17, 2022
• Expiry date: Jun 3, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/53266
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Process chamber lid assemblies and process chambers comprising same are described. The lid assembly has a housing with a gas dispersion channel in fluid communication with a lid plate. A contoured bottom surface of the lid plate defines a gap to a top surface of a gas distribution plate. A pumping channel is formed between an upper outer peripheral contour of the gas distribution plate and the lid plate.