Brian J. Coppa
15Patents
6h-index
22Co-inventors
62Inventor score
Filing activity: Jul 10, 2006 → Apr 27, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10773282B2 | Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy | Electricity | 37 | Active |
| US10446453B2 | Surface modification control for etch metric enhancement | Physics | 37 | Active |
| US10304668B2 | Localized process control using a plasma system | Electricity | 36 | Active |
| US8852851B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 18 | Active |
| US10333047B2 | Electrical, mechanical, computing/ and/or other devices formed of extremely low resistance materials | Emerging Cross-Sectional Technologies | 15 | Active |
| US8129289B2 | Method to deposit conformal low temperature SiO2 | Electricity | 9 | Active |
| US11289639B2 | Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials | Emerging Cross-Sectional Technologies | 6 | Active |
| US9761457B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 5 | Active |
| US10096483B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 4 | Active |
| US10607844B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 2 | Active |
| US9305782B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 1 | Active |
| US11335563B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 0 | Active |
| US11935756B2 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Electricity | 0 | Active |
| US11273469B2 | Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy | Electricity | 0 | Active |
| US12063874B2 | Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.