Bryan P. Segner
7Patents
5h-index
16Co-inventors
56Inventor score
Filing activity: Aug 16, 1989 → Aug 21, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5418190A | Method of fabrication for electro-optical devices | Electricity | 38 | Expired |
| US5036023A | Rapid thermal processing method of making a semiconductor device | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6437868B1 | In-situ automated contactless thickness measurement for wafer thinning | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6184582A | Article comprising a standoff complaint metallization and a method for making same | Electricity | 5 | Expired |
| US6625367B2 | Optoelectronic device having a P-contact and an N-contact located over a same side of a substrate and a method of manufacture therefor | Electricity | 5 | Expired |
| US6133125A | Selective area diffusion control process | Electricity | 1 | Expired |
| US5100836A | Method of making a semiconductor device | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.