Chengyu Niu
14Patents
6h-index
20Co-inventors
58Inventor score
Filing activity: Sep 17, 2009 → Jun 6, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8242876B2 | Dual thin film precision resistance trimming | Emerging Cross-Sectional Technologies | 19 | Active |
| US8400257B2 | Via-less thin film resistor with a dielectric cap | Emerging Cross-Sectional Technologies | 16 | Active |
| US9721889B1 | Middle of the line (MOL) metal contacts | Electricity | 10 | Active |
| US8493171B2 | Dual thin film precision resistance trimming | Emerging Cross-Sectional Technologies | 10 | Active |
| US8729702B1 | Copper seed layer for an interconnect structure having a doping concentration level gradient | Electricity | 8 | Active |
| US9059176B2 | Copper interconnect with CVD liner and metallic cap | Electricity | 6 | Active |
| US9111938B2 | Copper interconnect with CVD liner and metallic cap | Electricity | 3 | Active |
| US10283608B2 | Low resistance contacts to source or drain region of transistor | Electricity | 0 | Active |
| US10546789B2 | Methods of forming metal-gate semiconductor devices with enhanced mobility of charge carriers | Electricity | 0 | Active |
| US10438856B2 | Methods and devices for enhancing mobility of charge carriers | Electricity | 0 | Active |
| US9859217B1 | Middle of the line (MOL) metal contacts | Electricity | 0 | Active |
| US9679807B1 | Method, apparatus, and system for MOL interconnects without titanium liner | Electricity | 0 | Active |
| US10026693B2 | Method, apparatus, and system for MOL interconnects without titanium liner | Electricity | 0 | Active |
| US10553497B2 | Methods and devices for enhancing mobility of charge carriers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.